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	<title>Comments on: Core-i7-Ready Coolers</title>
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	<link>http://www.warepin.com/core-i7-ready-coolers/</link>
	<description>Computer Hardware</description>
	<lastBuildDate>Sun, 09 Oct 2011 17:46:14 +0000</lastBuildDate>
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		<title>By: Cressida</title>
		<link>http://www.warepin.com/core-i7-ready-coolers/comment-page-1/#comment-888</link>
		<dc:creator>Cressida</dc:creator>
		<pubDate>Fri, 20 Feb 2009 14:16:10 +0000</pubDate>
		<guid isPermaLink="false">http://www.warepin.com/?p=654#comment-888</guid>
		<description>Claiming that &#039;the cooling components are crafted out of the purest aluminium and copper materials&#039; is a bit disingenuous isn&#039;t it?

They aren&#039;t actually the PUREST aluminium and copper materials; surely to keep costs under control they are just REASONABLY pure aluminium and copper components, correct?

And the 30-degree thing adding &#039;increased airflow over nearby motherboard components&#039;?  
Almost the only people buying this will be enthusiasts; most of them will point their CPU fan to the top or the back of the case (depending where their extraction fans are).  Most motherboard manufacturers place necessarily cooled components (north-bridge, south-bridge etc.) away from this area... what possible advantage could this confer?</description>
		<content:encoded><![CDATA[<p>Claiming that &#8216;the cooling components are crafted out of the purest aluminium and copper materials&#8217; is a bit disingenuous isn&#8217;t it?</p>
<p>They aren&#8217;t actually the PUREST aluminium and copper materials; surely to keep costs under control they are just REASONABLY pure aluminium and copper components, correct?</p>
<p>And the 30-degree thing adding &#8216;increased airflow over nearby motherboard components&#8217;?<br />
Almost the only people buying this will be enthusiasts; most of them will point their CPU fan to the top or the back of the case (depending where their extraction fans are).  Most motherboard manufacturers place necessarily cooled components (north-bridge, south-bridge etc.) away from this area&#8230; what possible advantage could this confer?</p>
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		<title>By: Troy</title>
		<link>http://www.warepin.com/core-i7-ready-coolers/comment-page-1/#comment-828</link>
		<dc:creator>Troy</dc:creator>
		<pubDate>Thu, 09 Oct 2008 22:05:10 +0000</pubDate>
		<guid isPermaLink="false">http://www.warepin.com/?p=654#comment-828</guid>
		<description>I don&#039;t think anything that can be described as &quot;tilting the upper part of the heatsink by 30 degrees&quot; should be allowed to call itself &#039;Technology&#039;. Douchebags.</description>
		<content:encoded><![CDATA[<p>I don&#8217;t think anything that can be described as &#8220;tilting the upper part of the heatsink by 30 degrees&#8221; should be allowed to call itself &#8216;Technology&#8217;. Douchebags.</p>
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