Core-i7-Ready Coolers
Published by Bogdan Alex, on September 9th, 2008, in the categories: Coolers
The Core i7 CPUs (codename Nehalem) haven’t yet hit the market, but components design for these CPUs are already beginning to surface. The mobo integrators were first to present Core i7 compatible products, and now we take a look at a brand new Nexus air-based cooler specifically built to efficiently dissipate heat from those extremely overclocked Core i7 CPUs.
The Nexus FLC-3000 cooler features a unique design, combining a series of advanced technologies to provide optimal idle and load temperatures for the Nehalem chips. Nexus included 4 heat pipes at a 30° angle, the SkiveTek thechnology and 3 types of ultra-thin fins combined with a real silent PWM controlled fan in order to deliver ultimate performance and quiet operation.
As with the other models from the FLC lineup, the cooling components are crafted out of the purest aluminum and copper materials. The heat sink covering the heat pipes and the copper base is made using SkiveTek technology which slightly tilts one end of the heatsink and the heat pipes to a 30° angle for improved performance.
According to Guru3D, the 92mm fan mounted on the heatsink may spin with speeds between 900 and 2500 RPM, creating a noise-output of an inaudible 15 dB(A) up to 24 dB(A) at full speed. The 30° angle also adds to an increased airflow over the nearby motherboard components.
If you liked this post, subscribe to our blog by filling your e-mail address below:
Want to add something? Post your comments

2 Comments on “Core-i7-Ready Coolers”
Troy said on 10/09/2008:
I don't think anything that can be described as "tilting the upper part of the heatsink by 30 degrees" should be allowed to call itself 'Technology'. Douchebags.
Cressida said on 02/20/2009:
Claiming that 'the cooling components are crafted out of the purest aluminium and copper materials' is a bit disingenuous isn't it?
They aren't actually the PUREST aluminium and copper materials; surely to keep costs under control they are just REASONABLY pure aluminium and copper components, correct?
And the 30-degree thing adding 'increased airflow over nearby motherboard components'?
Almost the only people buying this will be enthusiasts; most of them will point their CPU fan to the top or the back of the case (depending where their extraction fans are). Most motherboard manufacturers place necessarily cooled components (north-bridge, south-bridge etc.) away from this area... what possible advantage could this confer?